Trans SES-700 is a multipurpose, single component heat curing thixtorpic paste adhesive of high impact strength and toughness, even at subzero temperatures. It is suitable for bonding a wide variety of metals and many other materials.
Trans SES-700 cures at 150-200��C, heat resistant to 120��C, very good peel strength, good chemical resistance, thixopropic – no flow during cure, gap filling to 3 mm, exceptionally good impact strength at temperatures down to -40��C.
Trans SES-700 may be stored for upto 3 months at 2��-8��C. The life of product is 3 months at 15-20��C after removal of from storage at 2�� – 8�� C.